Memory Mezzanine Assembly

Notes

1. The Memory Mezzanine option includes Assembly 541-2351,
   Air Duct 541-3064, Air Duct 541-3065, Shipping Bracket 341-4167,
   and eight FBDIMM Filler Panels 371-3651 or 330-4839 installed
   in the CMP1 side of the assembly.
2. The FRU includes Assembly 541-2351 and Shipping Bracket 341-4167.
3. Air Duct 541-3065 replaces Air Duct 541-2702 when the Mezzanine is installed.

Memory Notes

1. Eight, twelve, and sixteen FBDIMM configurations are supported on the system board.
2. Eight and sixteen FBDIMM configurations are supported on the memory mezzanine.
3. The system board requires sixteen FBDIMMs before installing the memory mezzanine.
4. Different size FBDIMMs on different CMPs are supported with firmware 7.1.7.f.
5. Different size FBDIMMs on different CMPs are supported with firmware 7.2.2.e.
6. BugID 6879970 affects mixed memory configurations with firmware 7.2.2.e.
7. Firmware 7.2.6 (Patch 139444-06) fixes BugID 6879970.
8. Mixing 1.8V and 1.5V FBDIMMs is not supported.
9. Low Voltage 1.5V FBDIMMs require System Firmware 7.1.6.d.
10. Memory Riser 501-7678 is only compatible with 1.8V VDD/VDDQ DIMMs.
11. Memory Riser 511-1231 is compatible with 1.5V and 1.8V VDD/VDDQ DIMMs.